Memory Core Chip Having TSVS

ABSTRACT

Disclosed herein is an apparatus that includes a memory cell array, a plurality of TSVs penetrating a semiconductor chip, an output circuit configured to output a data to the TSVs, an input circuit configured to receive a data from the TSVs, a pad supplied with a data from outside, and a control circuit configured to write the data to the memory cell array, read the data from the memory cell array, and transfer the data from the memory cell array to the input circuit via the output circuit and the TSVs.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No. 16/590,760, filed Oct. 2, 2019. This application is incorporated by reference herein in its entirety and for all purposes.

BACKGROUND

A semiconductor chip used in a memory device such as an HBM (High Bandwidth Memory) often includes many TSVs (Through Silicon Vias) provided to penetrate through a semiconductor substrate. The TSVs provided on each semiconductor chip are connected to TSVs provided on another semiconductor chip and located at same planar positions via bumps and pad electrodes, respectively, whereby signal paths penetrating through a plurality of semiconductor substrates are formed. In a case where a certain TSV is in a poor conduction state or there is poor connection at a connection point between two TSVs, the relevant signal path is defective and cannot be practically used. In this case, a spare signal path is used instead of the defective signal path to recover the defect.

Poor conduction of a TSV or poor connection at a connection point between two TSVs can be found only after a plurality of semiconductor chips are stacked. However, even if a defect is found on a signal path, it is difficult to determine whether this defect is caused by a detect of TSVs or a connection point between TSVs, or whether an input/output circuit connected to TSVs has a defect. Accordingly, a semiconductor device where an input/output circuit connected to TSVs can be tested before a plurality of semiconductor chips are stacked has been demanded.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view showing a floor plan of a memory core chip according to the present disclosure.

FIG. 2 is a schematic diagram showing a configuration of an HBM on which eight memory core chips according to the present disclosure are stacked one on top of another.

FIG. 3 is a table showing channels, slice addresses, and groups which are assigned to each of the memory core chips.

FIG. 4 is a schematic diagram for explaining a configuration of a signal path including a plurality of TSVs.

FIG. 5 is a schematic diagram for explaining a slate where fail information is loaded into a domino switch circuit of each of the chips.

FIG. 6A is a schematic diagram for explaining a connection relation in a state where replacement by the domino switch circuit is not performed.

FIG. 6B is a schematic diagram for explaining a connection relation in a state where replacement by the domino switch circuit is performed.

FIGS. 7A and 7B are schematic diagrams for explaining assignment of TSVs in a TSV area.

FIG. 8 is a schematic plan view showing a layout of the TSVs arranged in a region of the TSV area.

FIG. 9 is block diagram showing a circuit connected between the TSVs and a memory cell array.

FIGS. 10 to 12 are schematic diagrams for explaining a flow of a test data in a test operation.

DETAILED DESCRIPTION

Various embodiments of the present invention will be explained below in detail with reference to the accompanying drawings. The following detailed description refers to the accompanying drawings that show, by way of illustration, specific aspects and embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. Other embodiments may be utilized, and structural, logical and electrical changes may be made without departing from the scope of the present invention. The various embodiments disclosed herein are not necessary mutually exclusive, as some disclosed embodiments can be combined with one or more other disclosed embodiments to form new embodiments.

As shown in FIG. 1, a memory core chip according to the present disclosure includes four channels, TSV areas TAa and TAb, and a test pad TP. The four channels are channels Ch-A, Ch-C, Ch-E, and Ch-G, or Ch-B, Ch-D, Ch-F, and Ch-H. Each of the channels includes a memory cell array MA in which many DRAM memory cells are arranged in an array, and a peripheral circuit RIB. The channels can operate independently of each other. Therefore, terminals such as a data input/output terminal, an address terminal, a command terminal, and a clock terminal are assigned to each of the channels. In the present embodiment, the number of I/O bits per channel is 144 bits, where 128 bits are real data and 16 bits are ECC (Error Correction Code) data. The TSV areas TAa and TAb are a region in which a plurality of TSVs provided to penetrate through a semiconductor substrate are arranged in an array. Although not particularly limited, the region is divided into the two TSV areas TAa and TAb in the memory core chip according to the present disclosure. The TSV area TAa is assigned to the channel Ch-A/Ch-B and the channel Ch-C/Ch-D and the other TSV area TAb is assigned to the channel Ch-E/Ch-F and the channel Ch-G/Ch-H. The test pad TP is used to input/output data such as a test data through probing in a wafer state. The test pad TP is formed on the surface of the semiconductor substrate without penetrating therethrough, unlike the TSVs. The planar size of the test pad TP is sufficiently greater than that of the TSVs to enable probing.

As shown in FIG. 2, a plurality of memory core chips according to the present disclosure are stacked one on top of another on an interface chip 10 to thereby form an HBM. The interface chip 10 is a semiconductor chip that controls the memory core chips. In an example shown in FIG. 2, the HBM has a configuration in which eight memory core chips 20 to 27 are stacked on the interface chip 10. Assignment of channels, slice addresses SID, and groups DW to each of the memory core chips 20 to 27 is as shown in FIG. 3. As shown in FIG. 3, the channel Ch-A, Ch-C, Ch-E, and Ch-G are assigned to the memory core chips 20 to 23, and the channel Ch-B, Ch-D, Ch-F, and Ch-H are assigned to the memory core chips 24 to 27. A most significant bit SID0 of the slice address is assigned to the memory core chips 20, 22, 24, and 26 and a most significant bit SID1 of the slice address is assigned to the memory core chips 21, 23, 25, and 27. The slice address SID is a selection signal of the memory core chips 20 to 27 and one of the most significant bits SID0 and SID1 of the slice address is activated at the time of a practical access. Therefore, the memory core chips 20, 22, 24, and 26 and the memory core chips 21, 23, 25, and 27 are mutually exclusively accessed. Groups DW0 and DW2 are assigned to the memory core chips 20, 21, 24, and 25 and groups DW1 and DW3 are assigned to the memory core chips 22, 23, 26, and 27. The groups DW0 to DW3 are obtained by dividing I/O data of 144 bits per channel into four parts. Therefore, the number of I/O bits per group is 36 bits, where 32 bits are real data aid four bits are ECC data. With this configuration, a signal path through the TSVs is shared by two memory core chips. For example, focusing on the channel Ch-A, the memory core chips 20 and 22 are selected when the slice address SID0 is activated and the memory core chips 21 and 23 are selected when the slice address SID1 is activated. Because the same groups DW0 and DW2 are assigned to the memory core chip 20 and the memory core chip 21, a signal path P1 through the TSVs is assigned commonly to the memory core chip 20 and the memory core chip 21 and either one of these memory core chips is selected by the most significant bit SID of the slice address as shown in FIG. 2. Similarly, because the same groups DW1 and DW3 are assigned to the memory core chip 22 and the memory core chip 23, a signal path P2 through the TSVs is assigned commonly to the memory core chip 22 and the memory core chip 23 and either one thereof is selected by the most significant bit SID of the slice address as shown in FIG. 2.

As shown in FIG. 4, each of the interface chip 10 and the memory core chips 20 to 26 includes a plurality of TSVs 30 provided to penetrate through the corresponding semiconductor substrate. The interface chip 10 and the memory core chips 20 to 27 are all stacked by a face-down method, that is, in such a manner that principal surfaces on which transistors and wiring patterns (all not shown) are formed face downward. Accordingly, the memory core chip 27 located in the topmost layer does not need the TSVs 30. However, the memory core chip 27 located in the topmost layer may include the TSVs 30. Most of the TSVs 30 provided on the memory core chips 20 to 26 are connected to front TSV pads 31A located at same planar positions, respectively. In contrast thereto, majorities of the TSVs 30 provided on the interface chip 10 and the front TSV pads 31A provided on the interface chip 10 are located at different planar positions. The TSVs 30 located at the same planar positions among the TSVs 30 provided on the interface chip 10 and the memory core chips 20 to 26 are respectively cascade connected via the front TSV pads 31A, TSV bumps 31B, and back TSV pads 31C, so that a plurality of signal paths 32 are formed. Commands and write data output from the interface chip 10 are supplied to the memory core chips 20 to 27 via the signal paths 32. Read data output from the memory core chips 20 to 27 are supplied to the interface chip 10 via the signal paths 32. External terminals 33 are provided on the interface chip 10 and transmission/reception of signals to/from an external circuit is performed via the external terminals 33.

Some of the signal paths 32 are spare signal paths. The spare signal paths are used when a certain signal path 32 has a defect. As shown in FIG. 4, latch circuits L are assigned to the TSVs, respectively, and fail information is stored in latch circuits L corresponding to respective TSVs 30 in a defective signal path 32.

When the fail information is stored in the latch circuits L, connection relations between an internal circuit of the interface chip 10 and internal circuits of the memory core chips 20 to 27, and the TSVs 30 are switched, so that a spare signal path is used instead of the defective signal path. As shown in FIG. 5, a domino switch circuit 42 is provided in each of the interface chip 10 and the memory core chips 20 to 27. The domino switch circuits 42 are circuits for switching the connection relations between the internal circuit of the interface chip 10 and the internal circuits of the memory core chips 20 to 27, and the TSVs 30 and the connection relations between the internal circuit of the interface chip 10 and the internal circuits of the memory core chips 20 to 27, and the TSVs 30 are switched on the basis of the fail information stored in the latch circuits L. The fail information is first read from an antifuse circuit 40 during an initialization period after power activation and is loaded in common into the latch circuits L of the interface chip 10 and the memory core chips 20 to 27. Transfer of the fail information is performed through TSVs 30F for fail information transfer. Writing of the fail information to the antifuse circuit 40 is performed on the basis of a result of a screening test performed at the manufacturing stage.

As shown in FIG. 6A, each of the domino switch circuits 42 is connected between a plurality of input/output nodes of an internal circuit 46 and a plurality of the TSVs 30. In an example shown in FIG. 6A, the internal circuit 46 has eight input/output nodes N0 to N7 and nine TSVs 50 to 58 are assigned correspondingly thereto. Among these TSVs, eight TSVs 50 to 57 are original TSVs and one TSV 58 is a spare TSV. Corresponding latch circuits L0 to L7 are respectively assigned to the TSVs 50 to 57. In the example shown in FIG. 6A, the fail information is not stored in the latch circuits L0 to L7. In this case, the domino switch circuit 42 connects the input/output nodes N0 to N7 and the TSVs 50 to 57, respectively. Therefore, the spare TSV 58 is not used in this case. In contrast thereto, when the fail information is stored in, for example, the latch circuit L3 as shown in FIG. 6B, the domino switch circuit 42 connects the input/output nodes N0 to N7 and the TSVs 50 to 52 and 54 to 58, respectively. Accordingly, the TSV 53 corresponding to the latch circuit L3 is invalidated. In this way, the domino switch circuits 42 achieve recovery of a defect by shifting the connection relation between the input/output nodes N0 to N7 and the TSVs 50 to 58, without simply replacing a TSV to which the fail information is assigned with the spare TSV.

Fail information generated by an operation test performed during the initialization period after power activation may be also overwritten to the latch circuits L, as well as the fail information in the antifuse circuit 40 is loaded thereinto. An operation to overwrite the fail information by the operation test performed during the initialization period is called “auto repair operation”. A defect on the signal path is found in a screening test performed at the manufacturing stage and the fail information is written to the antifuse circuit 40 on the basis thereof. Accordingly, a signal path including a defect is replaced by a spare signal path. However, there are rare cases where a defective signal path newly emerges with temporal changes after shipment. An operation to find such a defect emerging afterward and replace a defective signal path with a spare signal path is the auto repair operation.

In the TSV areas TAa and TAb shown in FIG. 1, a plurality of TSVs penetrating through the semiconductor substrate are arranged. The TSVs arranged in the TSV area TAa and TAb are assigned as shown in FIGS. 7A and 7B, respectively. As shown in FIGS. 7A and 7B, the TSV area TAa and TAb include regions 61 to 68 where TSVs for I/O data are arranged, and a region 60 where TSVs to be used for transfer of addresses and commands are arranged. In an example shown in FIG. 7A, TSVs assigned to the group DW0 of the channel Ch-A are arranged in the region 61, TSVs assigned to the group DW0 of the channel Ch-B are arranged in the region 62, TSVs assigned to the group DW1 of the channel Ch-A are arranged in the region 63, and TSVs assigned to the group DW1 of the channel Ch-B are arranged in the region 64. As explained with reference to FIG. 3, the channel Ch-A and the channel Ch-B are assigned to different memory core chips, and the group DW0 and the group DW1 are assigned to different memory core chips, respectively. Accordingly, only one of the regions 61 to 64 is connected to the internal circuit in each of the memory core chips and the other three regions are bypassed. The same holds for the regions 65 to 68 arranged in the TSV area TAb.

FIG. 8 is a table showing a layout of the TSVs arranged in the region 61. As shown in FIG. 8, the TSVs arranged in the region 61 include 32 via conductors corresponding to data DQ0R to DQ31R, respectively, and 32 via conductors corresponding to data DQ0F to DQ31F, respectively. The data DQ0R to DQ31R are 32-bit data simultaneously input/output in synchronization with a rising edge of a clock signal, and the data DQ0F to DQ31F are 32-bit data simultaneously input/output in synchronization with a falling edge of the clock signal. Further, TSVs corresponding to data mask signals DM0R to DM3R and DM0F to DM3F, TSVs corresponding to read clock signals RCLKT and RCLKF, TSVs corresponding to write clock signals WCLKT and WCLKF, TSVs corresponding to spare signal paths R1 and R2, and TSVs for power sources VDD and VSS are also included in the region 61. In an example shown in FIG. 8, paired data, for example, the data DQ0R and the data DQ0F are arranged adjacently to each other. The spare signal path R1 is assigned to the data DQ0R to DQ31R and DQ0F to DQ31F and the data mask signals DM0R to DM3R and DM0F to DM3F. The spare signal path R2 is assigned to the TSVs corresponding to the read clock signals RCLKT and RCLKF and the TSVs corresponding to the write clock signals WCLKT and WCLKF.

FIG. 9 is a circuit diagram showing an example of a connection relation between TSVs and a memory cell array. In the example shown in FIG. 9, a read path 81 including an internal buffer 73, a read FIFO circuit 74, and an output buffer 76, and a write path 82 including an input receiver 77 and an internal buffer 79 are connected in parallel between a TSV 71 corresponding to the data DQ0R and a memory cell array 72. At the time of a normal operation, the read path 81 is activated in a read operation and the write path 82 is activated in a write operation. That is, the read path 81 and the write path 82 are mutually exclusively activated at the time of a normal operation. In contrast thereto, both the read path 81 and the write path 82 can be activated at the time of a test operation.

FIGS. 10 to 12 are schematic diagrams for explaining a flow of a test data in a test operation. The test operation shown in FIGS. 10 to 12 is performed under control by a control circuit 90 included in the memory core chips 20 to 27, and transmission/reception of a data to/from a tester is performed through a test pad TP1. Therefore, the test operation can be performed in a wafer state before stacking of the memory core chips 20 to 27.

In the test operation, a test data TDATA is first input from the test pad TP1 as shown in FIG. 10. The test data TDATA is written to the memory cell array MA via a switch circuit 91 included in the peripheral circuit RIB. At this time, a latch signal LDATA may be input via the test pad TP1. The latch signal LDATA is supplied to a latch control circuit 93 and accordingly fail information is written to any of the latch circuits L respectively assigned to the TSVs. It is alternatively possible to test paths assigned to regular TSVs without writing fail information to the latch circuits L in a first test and thereafter test a path assigned to a spare TSV by writing fail information to any of the latch circuits L.

Next, the test data TDATA written to the memory cell array MA is read out as shown in FIG. 11. The test data TDATA read from the memory cell array MA is transferred to a selector 94 via the switch circuit 91. The selector 94 is a circuit for switching the connection relation between the memory cell array MA and the regions 61 to 64 and selection thereby is performed on the basis of selection signals SEL0 to SEL3. For example, when the selection signal SEL0 is activated, the test data TDATA read from the memory cell array MA is supplied to the region 61. In this case, the regions 62 to 64 are separated from the memory cell array MA. In this way, the test data TDATA read from the memory cell array MA can be supplied to any of the regions 61 to 64 using the selection signals SEL0 to SEL3. This selection is enabled because which one of the regions 61 to 64 is to be connected to the memory cell array MA is undetermined in a wafer state while only one of the regions 61 to 64 is connected to the memory cell array MA and the other three regions are bypassed in a practical use.

When the test data TDATA is supplied to, for example, the region 61, the test data TDATA is supplied to each of corresponding TSVs via the read path 81 shown in FIG. 9. As described above, both the read path 81 and the write path 82 are activated at the time of a test operation. Therefore, the test data TDATA supplied to the TSVs via the read path 81 is returned to the switch circuit 91 via the write path 82 as shown in FIG. 12. That is, the test data TDATA read from the memory cell array MA pass through the read path 81, the TSVs, and the write path 82. To prevent the test data TDATA supplied to the read path 81 and the test data TDATA output from the write path 82 from colliding on a read/write bus, it suffices to delay the timing of supplying a clock signal to the read FIFO circuit 74 to delay the output timing of the test data TDATA output from the write path 82. The test data TDATA transferred to the switch circuit 91 is supplied to a compression circuit 92. The compression circuit 92 compresses the test data TDATA to generate a compression data CDATA. The compression data CDATA is information indicating whether the test data TDATA includes an error. The compression data CDATA is output from the test pad TP1 to outside.

As described above, in the present embodiment, not only a write operation and a read operation of the test data TDATA are performed to the memory cell array MA but also the test data TDATA read from the memory cell array MA is supplied to the compression circuit 92 via the read path 81 and the write path 82 at the time of a test operation. Therefore, whether the read path 81 and the write path 82 operate normally can be tested in a wafer slate. Furthermore, because the latch signal LDATA can be input via the test pad TP1, whether the read path 81 and the write path 82 corresponding to a spare signal path operate normally can be also tested in a wafer state.

Although this invention has been disclosed in the context of certain preferred embodiments and examples, it will be understood by those skilled in the art that the inventions extend beyond the specifically disclosed embodiments to other alternative embodiments and/or uses of the inventions and obvious modifications and equivalents thereof. In addition, other modifications which the within the scope of this invention will be readily apparent to those of skill in the art based on this disclosure. It is also contemplated that various combination or sub-combination of the specific features and aspects of the embodiments may be made and still fall within the scope of the inventions. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another in order to form varying mode of the disclosed invention. Thus, it is intended that the scope of at least some of the present invention herein disclosed should not be limited by the particular disclosed embodiments described above. 

1. A semiconductor chip comprising: a memory cell array; a test pad; a TSV penetrating through the semiconductor chip; read and write circuits coupled in parallel to the TSV; and a control circuit configured to: transfer data from the memory cell array to the TSV through the read circuit in a read operation; transfer data from the TSV to the memory cell array through the write circuit in a write operation; and pass test data between the memory cell array and the test pad through the read and write circuits in a test operation.
 2. The semiconductor chip according to claim 1, wherein the test data is input from outside the semiconductor chip.
 3. The semiconductor chip according to claim 1, further comprising: a switch circuit configured to transfer the test data from the test pad to the memory cell array; and a latch control circuit configured to receive a latch signal via the test pad.
 4. The semiconductor chip according to claim 3, wherein the latch signal triggers fail information to be written to a latch circuit corresponding to the TSV.
 5. The semiconductor chip according to claim 4, wherein the latch signal is supplied from outside the semiconductor device.
 6. The semiconductor chip according to claim 3, wherein the test data supplied to the TSV via the read circuit is returned to the switch circuit via the write circuit.
 7. The semiconductor chip according to claim 1, wherein the read circuit further comprises a read FIFO circuit configured to delay an output timing of the test data output from the write circuit in the test operation.
 8. The semiconductor chip according to claim 1, further comprising a compression circuit configured to generate compression data indicating whether the test data includes an error.
 9. An apparatus comprising: an interface chip; and a core chip stacked on the interface chip, the core chip comprising a memory cell array, a test pad, a control circuit, a TSV coupled to the interface chip, and a plurality of data buffers coupled to the TSV, wherein a read path comprises a data transmitter and at least one of the plurality of data buffers and a write path comprises a data receiver and at least another one of the plurality of data buffer, wherein the read path and the write path are coupled in parallel, and wherein the control circuit is configured to pass test data between the memory cell array and the test pad via the data transmitter and the data receiver in a test operation.
 10. The apparatus of claim 9, further comprising a compression circuit configured to generate compression data based on the test data, wherein the test data read from the memory cell array is supplied to the compression circuit via the data receiver and the data transceiver in the test operation.
 11. The apparatus of claim 10, wherein the compression data is outputted via the test pad.
 12. The apparatus of claim 9, wherein in an operation different than the test operation, the read path and the write path are mutually exclusively activated.
 13. The apparatus of claim 9, wherein the read path and the write path are activated at a time of the test operation.
 14. The apparatus of claim 9, wherein the test pad is supplied with test data through probing.
 15. A method comprising: transferring data from a memory cell array to a TSV via a read path in a read operation; transferring data from the TSV to the memory cell array via a write path in a write operation; inputting test data from outside a semiconductor chip to a test pad; and passing the test data between the memory cell array and the test pad via the read path and the write path in a test operation.
 16. The method according to claim 15, wherein passing the test data comprises writing the test data to the memory cell array and transferring the test data read from the memory cell array to a selector via a switch circuit.
 17. The method according to claim 16, wherein the selector is configured to supply the test data read from the memory cell array to a corresponding TSV region based on a selection signal.
 18. The method according to claim 17, wherein the test data is supplied to the corresponding TSV via the read path and is returned to the switch circuit via the write path.
 19. The method according to claim 15, further comprising: inputting a latch signal via the test pad; supplying the latch signal to a latch control circuit; and writing fail information to a latch circuit assigned to the TSV in response to the latch signal.
 20. The method according to claim 15, further comprising: compressing the test data to generate a compression data indicative of whether the test data includes an error; and supplying the compression data to the test pad. 